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Advanced Metallization Conference 2005 (AMC 2005): Volume 21

Engelsk Hardback

Advanced Metallization Conference 2005 (AMC 2005): Volume 21

Engelsk Hardback
Tjek vores konkurrenters priser
Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
Tjek vores konkurrenters priser
Normalpris
kr 278
Fragt: 39 kr
6 - 8 hverdage
20 kr
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God 4 anmeldelser på
Tjek vores konkurrenters priser
Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
Produktdetaljer
Sprog: Engelsk
Sider: 782
ISBN-13: 9781558998650
Indbinding: Hardback
Udgave:
ISBN-10: 1558998659
Udg. Dato: 1 jan 2006
Længde: 44mm
Bredde: 160mm
Højde: 235mm
Forlag: Materials Research Society
Oplagsdato: 1 jan 2006
Forfatter(e):
Forfatter(e)


Kategori Andre produktionsteknologier


ISBN-13 9781558998650


Sprog Engelsk


Indbinding Hardback


Sider 782


Udgave


Længde 44mm


Bredde 160mm


Højde 235mm


Udg. Dato 1 jan 2006


Oplagsdato 1 jan 2006


Forlag Materials Research Society

Kategori sammenhænge