Store besparelser
Hurtig levering
Gemte
Log ind
0
Kurv
Kurv

3D Interconnect Architectures for Heterogeneous Technologies

- Modeling and Optimization

3D Interconnect Architectures for Heterogeneous Technologies

- Modeling and Optimization
Tjek vores konkurrenters priser
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
Tjek vores konkurrenters priser
Normalpris
kr 1.002
Fragt: 39 kr
6 - 8 hverdage
20 kr
Pakkegebyr
God 4 anmeldelser på
Tjek vores konkurrenters priser
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
Produktdetaljer
Sprog: Engelsk
Sider: 395
ISBN-13: 9783030982317
Indbinding: Paperback
Udgave:
ISBN-10: 3030982319
Udg. Dato: 29 jun 2023
Længde: 0mm
Bredde: 155mm
Højde: 235mm
Forlag: Springer Nature Switzerland AG
Oplagsdato: 29 jun 2023
Forfatter(e) Jan Moritz Joseph, Alberto Garcia-Ortiz, Thilo Pionteck, Lennart Bamberg


Kategori Elektronik: kredse og komponenter


ISBN-13 9783030982317


Sprog Engelsk


Indbinding Paperback


Sider 395


Udgave


Længde 0mm


Bredde 155mm


Højde 235mm


Udg. Dato 29 jun 2023


Oplagsdato 29 jun 2023


Forlag Springer Nature Switzerland AG

Vi anbefaler også
Kategori sammenhænge