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Advances In 3d Integrated Circuits And Systems
Engelsk
Bogcover for Advances In 3d Integrated Circuits And Systems af Chuan Seng Tan, Hao Yu, 9789814699013
Specifikationer
Sprog:
Engelsk
Sider:
392
ISBN-13:
9789814699013
Indbinding:
Paperback
ISBN-10:
9814699012
Udg. Dato:
16 okt 2015
Størrelse i cm:
15,5 x 23,0 x 2,2
Oplagsdato:
16 okt 2015
Forfatter(e):

Advances In 3d Integrated Circuits And Systems

Engelsk
Paperback 2015
Format:

Bog beskrivelse

 

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.

Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

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Specifikationer
Sprog:
Engelsk
Sider:
392
ISBN-13:
9789814699013
Indbinding:
Paperback
ISBN-10:
9814699012
Udg. Dato:
16 okt 2015
Størrelse i cm:
15,5 x 23,0 x 2,2
Oplagsdato:
16 okt 2015
Forfatter(e):
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