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Electromigration Modeling at Circuit Layout Level
Engelsk
Bogcover for Electromigration Modeling at Circuit Layout Level af Cher Ming Tan, Feifei He, 9789814451208
Specifikationer
Sprog:
Engelsk
Sider:
103
ISBN-13:
9789814451208
Indbinding:
Paperback
ISBN-10:
9814451207
Udg. Dato:
4 maj 2013
Størrelse i cm:
23,5 x 15,5
Oplagsdato:
4 maj 2013
Forfatter(e):

Electromigration Modeling at Circuit Layout Level

Engelsk
Paperback 2013
Format:

Bog beskrivelse
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
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Specifikationer
Sprog:
Engelsk
Sider:
103
ISBN-13:
9789814451208
Indbinding:
Paperback
ISBN-10:
9814451207
Udg. Dato:
4 maj 2013
Størrelse i cm:
23,5 x 15,5
Oplagsdato:
4 maj 2013
Forfatter(e):
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