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Low-K Nanoporous Interdielectrics
- Materials, Thin Film Fabrications, Structures & Properties
Engelsk Paperback

Low-K Nanoporous Interdielectrics

- Materials, Thin Film Fabrications, Structures & Properties
Engelsk Paperback

654 kr
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Om denne bog
The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics. This book provides an overview of the methodologies and characterisation techniques used for investigating low-k nanoporous interdielectrics.
Product detaljer
Sprog:
Engelsk
Sider:
67
ISBN-13:
9781616687496
Indbinding:
Paperback
Udgave:
ISBN-10:
1616687495
Kategori:
Udg. Dato:
19 mar 2011
Længde:
5mm
Bredde:
155mm
Højde:
230mm
Forlag:
Nova Science Publishers Inc
Oplagsdato:
19 mar 2011
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