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Recent Trends in VLSI and Semiconductor Packaging
Engelsk
Bogcover for Recent Trends in VLSI and Semiconductor Packaging af , 9781041017875
Specifikationer
Sprog:
Engelsk
Sider:
616
ISBN-13:
9781041017875
Indbinding:
Paperback
ISBN-10:
1041017871
Kategori:
Udg. Dato:
6 maj 2025
Størrelse i cm:
28,0 x 21,0
Oplagsdato:
6 maj 2025

Recent Trends in VLSI and Semiconductor Packaging

Engelsk
Paperback 2025
Format:

Bog beskrivelse

The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

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Specifikationer
Sprog:
Engelsk
Sider:
616
ISBN-13:
9781041017875
Indbinding:
Paperback
ISBN-10:
1041017871
Kategori:
Udg. Dato:
6 maj 2025
Størrelse i cm:
28,0 x 21,0
Oplagsdato:
6 maj 2025
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