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Solder Paste in Electronics Packaging
- Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Engelsk
Bogcover for Solder Paste in Electronics Packaging af Jennie S. Hwang, 9789401160520
Specifikationer
Sprog:
Engelsk
Sider:
456
ISBN-13:
9789401160520
Indbinding:
Paperback
ISBN-10:
940116052X
Kategori:
Udg. Dato:
20 feb 2012
Størrelse i cm:
22,9 x 15,2
Forlag:
Oplagsdato:
20 feb 2012
Forfatter(e):

Solder Paste in Electronics Packaging

- Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Engelsk
Paperback 2012
Format:

Bog beskrivelse
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech­ nology.
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Specifikationer
Sprog:
Engelsk
Sider:
456
ISBN-13:
9789401160520
Indbinding:
Paperback
ISBN-10:
940116052X
Kategori:
Udg. Dato:
20 feb 2012
Størrelse i cm:
22,9 x 15,2
Forlag:
Oplagsdato:
20 feb 2012
Forfatter(e):
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