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Through Silicon Vias
- Materials, Models, Design, and Performance
Engelsk
Bogcover for Through Silicon Vias af Arsalan Alam, Manoj Kumar Majumder, Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, 9780367574543
Specifikationer
Sprog:
Engelsk
Sider:
216
ISBN-13:
9780367574543
Indbinding:
Paperback
ISBN-10:
0367574543
Udg. Dato:
30 jun 2020
Størrelse i cm:
23,4 x 15,6
Oplagsdato:
30 jun 2020

Through Silicon Vias

- Materials, Models, Design, and Performance
Engelsk
Paperback 2020
Format:

Bog beskrivelse

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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Specifikationer
Sprog:
Engelsk
Sider:
216
ISBN-13:
9780367574543
Indbinding:
Paperback
ISBN-10:
0367574543
Udg. Dato:
30 jun 2020
Størrelse i cm:
23,4 x 15,6
Oplagsdato:
30 jun 2020
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