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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Engelsk
Bogcover for Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces af Qingke Zhang, 9783662517253
Specifikationer
Sprog:
Engelsk
Sider:
143
ISBN-13:
9783662517253
Indbinding:
Paperback
ISBN-10:
3662517256
Kategori:
Udg. Dato:
23 aug 2016
Størrelse i cm:
23,5 x 15,5
Oplagsdato:
23 aug 2016
Forfatter(e):

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Engelsk
Paperback 2016
Format:

Bog beskrivelse
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
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Specifikationer
Sprog:
Engelsk
Sider:
143
ISBN-13:
9783662517253
Indbinding:
Paperback
ISBN-10:
3662517256
Kategori:
Udg. Dato:
23 aug 2016
Størrelse i cm:
23,5 x 15,5
Oplagsdato:
23 aug 2016
Forfatter(e):
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