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3D Interconnect Architectures for Heterogeneous Technologies

- Modeling and Optimization

3D Interconnect Architectures for Heterogeneous Technologies

- Modeling and Optimization
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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
Produktdetaljer
Sprog: Engelsk
Sider: 395
ISBN-13: 9783030982287
Indbinding: Hardback
Udgave:
ISBN-10: 3030982289
Udg. Dato: 28 jun 2022
Længde: 0mm
Bredde: 155mm
Højde: 235mm
Forlag: Springer Nature Switzerland AG
Oplagsdato: 28 jun 2022
Forfatter(e) Jan Moritz Joseph, Alberto Garcia-Ortiz, Thilo Pionteck, Lennart Bamberg


Kategori Elektronik: kredse og komponenter


ISBN-13 9783030982287


Sprog Engelsk


Indbinding Hardback


Sider 395


Udgave


Længde 0mm


Bredde 155mm


Højde 235mm


Udg. Dato 28 jun 2022


Oplagsdato 28 jun 2022


Forlag Springer Nature Switzerland AG

Kategori sammenhænge